AMX Rack Rail Kit MMS Servers Especificaciones Pagina 17
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Chapter 1. General description 3
Draft Document for Review May 22, 2009 3:10 pm 4405ch01 General description.fm
1.1 System specifications
Table 1-1 lists the general system specifications of a single Central Electronics Complex
(CEC) enclosure.
Table 1-1 System specifications
1.2 Physical package
The system is available only in a rack-mounted form factor. It is a modular-built system
utilizing between one and four building block enclosures. Each of these CEC drawer building
blocks is packaged in a 4U
1
rack-mounted enclosure. The major physical attributes for each
building block are shown in Table 1-2.
Table 1-2 Physical packaging of CEC drawer
To help ensure the installation and serviceability in non-IBM, industry-standard racks, review
the vendor’s installation planning information for any product-specific installation
requirements.
Description Range (operating)
Operating temperature 5 to 35 degrees C (41 to 95 F)
Relative humidity 8% to 80%
Maximum wet bulb 23 degrees C (73 F)
Noise level with 3.5 GHz processors FC 5620: 7.1 bels
with 3.5 GHz processors FC 5620 and acoustic rack doors:
6.7 bels
with 4.2 GHz processors FC 5622: 7.1 bels
with 4.2 GHz processors FC 5622 and acoustic rack doors:
6.7 bels
with 4.7 GHz processors FC 7380: 7.4 bels
with 4.7 GHz processors FC 7380 and acoustic rack doors:
6.9 bels
Operating voltage 200 to 240 V ac 50/60 Hz
Maximum power consumption 1400 watts (maximum)
Maximum power source loading 1.428 kVA (maximum)
Maximum thermal output 4778 BTU
a
/hr (maximum)
a. British Termal Unit (BTU)
Maximum altitude 3,048 m (10,000 ft)
1
One Electronic Industries Association Unit (1U) is 44.45 mm (1.75 in.).
Dimension One CEC drawer
Height 174 mm (6.85 in)
Width 483 mm (19.0 in.)
Depth 824 mm (32.4 in.) from front of Bezel to rear of Power Supply
674 mm (25.6 in.) front rack rail mounting surface to I/O Adapter Bulkhead
793 mm (31.2 in.) front rack rail mounting surface to rear of Power Supply
Weight 63.6 kg (140 lb.)
- Redpaper 1
- October 2008 3
- First Edition (October 2008) 4
- Contents 5
- Contents v 7
- Trademarks 10
- Become a published author 12
- Comments welcome 13
- General description 15
- 1.1 System specifications 17
- 1.2 Physical package 17
- 1.3 System features 18
- 1.3.2 Memory features 20
- 1.3.4 I/O drawers 22
- Front Rear 24
- 1.4 System racks 26
- Physical specifications 28
- Client responsibilities 28
- 1.4.5 Rack-mounting rules 31
- 1.4.6 Useful rack additions 32
- 1.4.7 OEM rack 33
- Architecture and technical 37
- 2.1 The POWER6 processor 38
- Figure 2-2 POWER6 processor 39
- 2.1.1 Decimal floating point 40
- 2.3 Processor cards 43
- 2.3.2 Processor clock rate 44
- 2.4 Memory subsystem 45
- 2.4.4 OEM memory 48
- 2.5 System buses 49
- 2.5.2 Service processor bus 50
- 2.6 Internal I/O subsystem 51
- 2.6.1 System ports 52
- POWER6 chip 56
- 2.8 PCI adapters 57
- 2.8.1 LAN adapters 58
- 2.8.2 SCSI and SAS adapters 58
- 2.8.3 iSCSI 59
- IBM iSCSI adapters 60
- 2.8.4 Fibre Channel adapter 61
- 2.8.5 Graphic accelerators 61
- 2.9 Internal storage 62
- 2.9.2 Split backplane 63
- 2.9.3 Internal media devices 63
- 2.10 External I/O subsystems 64
- 7311 Model D11 features 65
- PCI-X Bridge 66
- PCI-X slots 67
- SPCN cabling examples 68
- YO Cable 71
- IBM AIX 5L 77
- IBM AIX V6.1 77
- Linux for System p systems 78
- 2.13 Service information 79
- 2.14 System firmware 81
- System firmware download site 82
- 2.14.1 Service processor 84
- System Management Services 86
- Open Firmware 87
- Virtualization 89
- 3.1 POWER Hypervisor 90
- Virtual SCSI 91
- Virtual Ethernet 91
- Virtual (TTY) console 91
- 3.2 Logical partitioning 92
- 3.2.3 Processing mode 93
- Dedicated mode 94
- Shared dedicated mode 94
- Shared mode 94
- 3.3 PowerVM 95
- Shared Ethernet Adapter 96
- Chapter 3. Virtualization 83 97
- 3.3.3 PowerVM Lx86 99
- Supported Operating Systems 100
- Chapter 3. Virtualization 87 101
- Chapter 3. Virtualization 89 103
- 3.4 System Planning Tool 105
- Continuous availability and 107
- Component failure rates 108
- 4.2 Availability 109
- Persistent deallocation 110
- Memory protection 113
- Memory page deallocation 114
- Memory control hierarchy 114
- Memory deconfiguration 115
- L2 Array Protection 116
- 4.2.4 PCI Error Recovery 117
- 4.3 Serviceability 118
- 4.3.1 Detecting errors 119
- Error checkers 120
- Fault Isolation Registers 120
- 4.3.2 Diagnosing problems 121
- Boot-time 122
- Device drivers 122
- 4.3.3 Reporting problems 123
- Extended Error Data (EED) 124
- System dump handling 124
- Customer notify 124
- Call home 124
- Guiding light LEDs 125
- The operator panel 125
- Concurrent maintenance 126
- Blind-swap PCI adapters 126
- Firmware updates 126
- Repair and verify 127
- 4.5 Manageability 130
- Graphics terminal 134
- Example 4-1 135
- 4.6 Cluster solution 136
- Related publications 139
- Online resources 140
- How to get Redbooks 140
- Help from IBM 140
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